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Precision MTS Bonding Jig

Precision MTS Bonding Jig

Brand Name: OEM
Model Number: OEM
MOQ: 1
Price: To be discussed
Payment Terms: To be discussed
Supply Ability: To be discussed
Detail Information
Place of Origin:
China
Material:
AL6061+Brass
Surface Coating:
Hard Anodizing
Application:
SMT Line
Packaging Details:
Carton/Wood box
Supply Ability:
To be discussed
Product Description

Syris Precision MTS Bonding Jig

Manufactured by Syris, this precision assembly fixture is built from hard-anodized AL6061 aluminum alloy combined with brass components, designed for high-precision bonding board testing (MTS) applications in electronics manufacturing.

Key Features:

  • Material: Hard-anodized AL6061 aluminum alloy body for enhanced surface hardness, wear resistance, and durability under repeated cycling; brass inserts/bushings for precise, low-wear contact points
  • Surface Treatment: Type III hard anodizing provides a dark, corrosion-resistant, electrically insulating surface finish suitable for sensitive electronic assembly environments
  • Design: Multi-cavity plate structure with an intricate lattice of precision-machined through-holes and pockets for component clearance, alignment, and airflow/vacuum pathways
  • Precision Contacts: Four brass rotary alignment/socket fixtures integrated into the lower section for accurate part seating and repeatable positioning
  • Hardware: Captive quarter-turn fasteners with rotation-direction indicators for quick, tool-assisted mounting and removal
  • Labeling: Laser-etched identification including product code (CV0014), part description, model number, QR/data matrix code for traceability, and directional orientation arrow
  • Application: Used as an MTS (mechanical test system) jig for bonding board (BG bonding) testing — specifically for burn-in, functional test, or bonding process fixturing (Civet/D8X platform)

Manufacturing Capabilities:
Syris specializes in precision CNC machining and hard anodizing processes, delivering custom test and bonding fixtures with tight tolerances, mixed-material assembly (aluminum + brass), and full traceability marking for semiconductor and electronics test applications.